Method for making backlight module

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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Details

C362S555000, C362S581000, C362S611000, C362S607000, C362S612000, C438S025000, C438S026000, C438S029000

Reexamination Certificate

active

07579198

ABSTRACT:
An exemplary method for making a backlight module, the method includes steps in following order: providing a transparent base sheet and at least one light emitting diode; punching the base sheet to form an aperture therein; fixing the at lease one light emitting diode in the aperture, the at least one light emitting diode and an inner side surface of the aperture cooperatively defining a space; injecting an adhesive into the space between the at least one light emitting diode and the inner side surface of the aperture; solidifying the adhesive; and trimming the base sheet with the at least one light emitting diode in the aperture to form the backlight module.

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patent: 2006/0071085 (2006-04-01), Philyaw et al.
patent: 2006/0092665 (2006-05-01), Kim et al.

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