Computing device including a stacked semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257S687000, C257S777000, C257SE25006, C257SE25013

Reexamination Certificate

active

07626253

ABSTRACT:
The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip (20) disposed on a substrate (10), a first sealing resin (26) sealing the first semiconductor chip (20), a built-in semiconductor device (30) disposed on the first sealing resin (26), and a second sealing resin (36) sealing the first sealing resin (26) and the built-in semiconductor device (30) and covering a side surface (S) of the substrate (10). According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.

REFERENCES:
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6766320 (2004-07-01), Wang et al.
patent: 6815746 (2004-11-01), Suzuki et al.
patent: 6946323 (2005-09-01), Heo
patent: 7205644 (2007-04-01), Kuo et al.
patent: 2002/0041025 (2002-04-01), Tomihara
patent: 2006/0220208 (2006-10-01), Onodera et al.
patent: 6177323 (1994-06-01), None
patent: 10223683 (1998-08-01), None

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