Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate
2005-06-03
2009-10-06
Pham, Thanh V (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including dielectric isolation means
C438S294000
Reexamination Certificate
active
07598590
ABSTRACT:
The semiconductor chip1has a semiconductor substrate10. In the present embodiment, the semiconductor substrate10, which is an SOI substrate, is constituted by comprising a support substrate12, an insulating layer14formed on the support substrate12with a layered structure, and a silicon layer16formed on the insulating layer14with the layered structure. The semiconductor substrate10has a circuit forming region A1provided in the silicon layer16. An insulating region18is provided on the semiconductor substrate10. The insulating region18is provided so as to surround the entire side face of the circuit forming region A1.
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Kawano Masaya
Kurita Yoichiro
Tashiro Tsutomu
NEC Electronics Corporation
Pham Thanh V
Sughrue & Mion, PLLC
Valentine Jami M
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