Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-08-30
2009-02-24
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S707000, C257S713000, C257S787000, C257S797000, C257SE23052, C257SE23179, C438S122000, C438S123000, C438S127000, C438S462000, C361S707000, C361S709000
Reexamination Certificate
active
07495323
ABSTRACT:
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the coupling portions of the bridge. A semiconductor device is attached to both the conductive bridge and the lead frame, and is configured so that the coupling portions are on opposing sides of the semiconductor device.
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Arbuthnot Roger
Carney Francis J.
Celaya Phillip
St. Germain Stephen
Chambliss Alonzo
Jackson Kevin B.
Semiconductor Components Industries L.L.C.
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