Methods of making and using a floating lead finger on a lead...

Details Methods of making and using a floating lead finger on a lead... Methods of making and using a floating lead finger on a lead...

2005-12-22

2009-08-11

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C257SE23031

Reexamination Certificate

active

07572678

ABSTRACT:
A semiconductor device assembly includes a semiconductor device and a lead frame having lead fingers for connection to the semiconductor device. The lead frame may include floating no-connect (NC) lead fingers with inner portions of the floating NC lead fingers electrically isolated from the semiconductor device and the associated outer portion of the floating NC lead fingers. Floating NC lead fingers may separate lead fingers prone to causing induction noise from lead fingers subject to induction effects. The floating NC lead fingers may thus reduce the inductance noise of the lead fingers. The floating NC lead fingers may also allow the semiconductor device to be securely adhered to the lead fingers with no air pockets therebetween. A method of forming a semiconductor device assembly is also provided.

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