Lead frame, method of manufacturing a face-down terminal...

Details Lead frame, method of manufacturing a face-down terminal... Lead frame, method of manufacturing a face-down terminal...

2006-11-06

2009-06-02

Ha, Nguyen T (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

C361S525000, C361S528000, C361S529000, C361S516000, C361S519000, C029S025010, C029S025030

Reexamination Certificate

active

07542267

ABSTRACT:
In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.

REFERENCES:
patent: 6236561 (2001-05-01), Ogino et al.
patent: 6262878 (2001-07-01), Shirashige et al.
patent: 6816358 (2004-11-01), Kida et al.
patent: 6819546 (2004-11-01), Kuriyama
patent: 6891717 (2005-05-01), Fujii et al.
patent: 6903922 (2005-06-01), Sano et al.
patent: 6975503 (2005-12-01), Abe et al.
patent: 7110245 (2006-09-01), Ishida et al.
patent: 2004/0125542 (2004-07-01), Fujii et al.
patent: 2006/0126273 (2006-06-01), Ishijima
patent: 2003-133177 (2003-05-01), None
patent: 2004-349270 (2004-12-01), None
patent: 2005-197457 (2005-07-01), None
patent: 2006-190965 (2006-07-01), None
Korean Office Action (and English Translation) dated Jan. 31, 2008, issued in counterpart Korean Application No. 10-2006-109374.

Affiliated with

Also associated with

Rating

Lead frame, method of manufacturing a face-down terminal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame, method of manufacturing a face-down terminal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame, method of manufacturing a face-down terminal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4125071