Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-02-14
2009-11-10
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S679000, C257S693000, C711S118000, C711S132000
Reexamination Certificate
active
07615857
ABSTRACT:
A chip multiprocessor die supports optional stacking of additional dies. The chip multiprocessor includes a plurality of processor cores, a memory controller, and stacked cache interface circuitry. The stacked cache interface circuitry is configured to attempt to retrieve data from a stacked cache die if the stacked cache die is present but not if the stacked cache die is absent. In one implementation, the chip multiprocessor die includes a first set of connection pads for electrically connecting to a die package and a second set of connection pads for communicatively connecting to the stacked cache die if the stacked cache die is present. Other embodiments, aspects and features are also disclosed.
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Dang Phuc T
Hewlett--Packard Development Company, L.P.
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