Integrated circuits with inductors in multiple conductive...

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

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Reexamination Certificate

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07489220

ABSTRACT:
Two inductors formed in multiple layers of conductive layers of integrated circuits are disclosed. Symmetric portions of a first inductor and a second inductor are formed in two or more conductive layers. Portions of the first inductor in adjacent conductive layers are connected by vias, and portions of the second inductor in adjacent conductive layers are connected by vias. The first and second inductor portions form a substantially loop-shaped structure in each conductive layer. The first and second inductor vias may be positioned at the same position within the substantially loop-shaped inductor structure by alternating inner and outer radiuses, or the vias for the second inductor may be positioned opposite the vias for the first inductor within the substantially loop-shaped inductor structure, using notches in the first and second inductor portions.

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patent: 6380835 (2002-04-01), Lee
patent: 6759937 (2004-07-01), Kyriazidou
patent: 7164339 (2007-01-01), Huang
patent: 2003/0071706 (2003-04-01), Christensen
patent: 2005/0046501 (2005-03-01), Moore
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patent: 102 61 385 (2004-07-01), None
patent: WO 2005/010900 (2005-02-01), None
Tiebout, M., “A Fully Integrated 1.3 GHz VCO for GSM in 0.25 μm Standard CMOS with a Phasenoise of -142dBc/Hz at 3MHz Offset,” Proceedings 30th European Microwave Conference, Oct. 2000, 4 pages, Paris, France.
“Transformer,” downloaded Jun. 15, 2005, 3 pages, http://hyperphysics.phy-astr.gsu.edu/hbase/magnetic/transf.html.

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