RFID tag

Communications: electrical – Condition responsive indicating system – Specific condition

Reexamination Certificate

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Details

C156S560000, C438S106000, C235S492000

Reexamination Certificate

active

07486191

ABSTRACT:
The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

REFERENCES:
patent: 6407669 (2002-06-01), Brown et al.
patent: 2003/0168514 (2003-09-01), Rancien et al.
patent: 2005/0085010 (2005-04-01), Tsunoda et al.
patent: 2005/0093677 (2005-05-01), Forster et al.
patent: 2005/0134461 (2005-06-01), Gelbman et al.
patent: 199 62 194 (2001-06-01), None
patent: 0 977 145 (2000-02-01), None
patent: 2000-200332 (2000-07-01), None
patent: 2000-311226 (2000-11-01), None
patent: 2001-351082 (2001-12-01), None
patent: 2001-351083 (2001-12-01), None
European Search Report dated Mar. 27, 2008.

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