Low cost cold plate with film adhesive

Details Low cost cold plate with film adhesive Low cost cold plate with film adhesive

2007-06-19

2009-02-24

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S700000, C361S709000, C361S710000, C165S080300, C165S080400, C257S714000

Reexamination Certificate

active

07495916

ABSTRACT:
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.

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EPO search report dated Oct. 14, 2008.

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