Method for holding semiconductor wafer

Details Method for holding semiconductor wafer Method for holding semiconductor wafer

2008-05-02

2009-10-06

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S460000, C438S463000, C257SE21237, C257SE21329, C257SE21499

Reexamination Certificate

active

07598120

ABSTRACT:
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground; separating the protective tape from a surface of the semiconductor wafer W having an annular projected part formed in the outer peripheral part of the back side; applying a holding tape over the surface of the semiconductor wafer W from which the protective tape having been separated and a surface of a ring frame f; removing and separating the outer peripheral part in the semiconductor wafer applied and held on the holding tape, by annularly cutting; applying a dicing tape over the back side of the semiconductor wafer having been made flat and the back side of the ring frame; and separating the holding tape from the ring frame and the semiconductor wafer.

REFERENCES:
patent: 7122447 (2006-10-01), Abe
patent: 2004/0097054 (2004-05-01), Abe
patent: 2007/0015342 (2007-01-01), Abe
patent: 2007-103582 (2007-04-01), None

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