Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2003-12-04
2009-06-23
Aftergut, Jeff H (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S153000, C156S281000, C148SDIG012, C148SDIG013, C148SDIG015
Reexamination Certificate
active
07550052
ABSTRACT:
The invention relates to a method of producing a complex microelectronic structure, in which two basic microelectronic structures are assembled at the two respective connecting faces thereof. The invention is characterized in that, before assembly, a difference is created in the tangential stress state between the two faces to be assembled, said difference being selected such as to produce a pre-determined stress state within the assembled structure under given conditions in relations to the assembly conditions.
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Fournel Franck
Montmayeul Phillippe
Moriceau Hubert
Aftergut Jeff H
Brinks Hofer Gilson & Lione
Commissariat a l''Energie Atomique
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