Semiconductor substrates having useful and transfer layers

Details Semiconductor substrates having useful and transfer layers Semiconductor substrates having useful and transfer layers

2008-08-06

2009-11-24

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S409000, C438S455000, C438S458000, C257SE21568

Reexamination Certificate

active

07622330

ABSTRACT:
A method of fabricating composite substrates by associating a plurality of transfer layers in spaced relation upon a single intermediate support; providing a support layer on each transfer layer to form a composite substrate; and detaching the composite substrates from the intermediate support. The support layer is made of a deposited material that has a lower quality than that of the intermediate support. A bonding layer may be included on one of the intermediate support or the useful layer, or both, to facilitate bonding of the layers. The final substrates are useful in optic, electronic, or optoelectronic applications.

REFERENCES:
patent: 4983251 (1991-01-01), Haisma et al.
patent: 5374564 (1994-12-01), Bruel
patent: 5966620 (1999-10-01), Sakaguchi et al.
patent: 6010579 (2000-01-01), Henley et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6107213 (2000-08-01), Tayanaka et al.
patent: 6114188 (2000-09-01), Oliver et al.
patent: 6214701 (2001-04-01), Matsushita et al.
patent: 6326279 (2001-12-01), Kakizaki et al.
patent: 6420283 (2002-07-01), Ogawa et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6774435 (2004-08-01), Matsumoto et al.
patent: 6878607 (2005-04-01), Inoue et al.
patent: 2003/0017712 (2003-01-01), Brendel
patent: 0 528 229 (1993-02-01), None
patent: 0 843 344 (1998-05-01), None
patent: 0 915 503 (1999-05-01), None
patent: 0 924 769 (1999-06-01), None
patent: 2 787 919 (2000-06-01), None
patent: 5-101998 (1993-04-01), None
patent: 9-115832 (1997-05-01), None
patent: 10-200080 (1998-07-01), None
patent: 11-026733 (1999-01-01), None
patent: 11-135882 (1999-05-01), None
patent: WO 98/52216 (1998-11-01), None
patent: WO 99/01899 (1999-01-01), None
patent: WO 99/41776 (1999-08-01), None

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