Mounting substrate and mounting method of electronic part

Details Mounting substrate and mounting method of electronic part Mounting substrate and mounting method of electronic part

2004-09-13

2009-02-17

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S772000

Reexamination Certificate

active

07491893

ABSTRACT:
A mounting substrate includes a land connected to an electrode of an electronic part by a melt-capable connection member; and a connection member flow-generation part configured to generate a flow at the molten melt-capable connection member.

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Korean Office Action dated Apr. 24, 2006.

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