Method of soldering electronic component having solder bumps...

Details Method of soldering electronic component having solder bumps... Method of soldering electronic component having solder bumps...

2005-06-22

2009-08-04

Lorengo, Jerry (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S180100, C228S180210

Reexamination Certificate

active

07568610

ABSTRACT:
A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

REFERENCES:
patent: 5439162 (1995-08-01), George et al.
patent: 6189771 (2001-02-01), Maeda et al.
patent: 6209196 (2001-04-01), Ozono et al.
patent: 6460755 (2002-10-01), Inoue et al.
patent: 6951666 (2005-10-01), Kodas et al.
patent: 2002/0033275 (2002-03-01), Sumi et al.
patent: 2002/0185309 (2002-12-01), Imamura et al.
patent: 2003/0066681 (2003-04-01), Uchida et al.
patent: 11-145192 (1999-05-01), None
patent: 2000-031210 (2000-01-01), None
patent: 2000-114301 (2000-04-01), None
patent: 2000-228575 (2000-08-01), None
patent: 2002-224884 (2002-08-01), None
patent: 2003-117681 (2003-04-01), None
Bhushan, Bharat. Contact mechanics of rough surfaces in tribology: multiple asperity contact, 1998, Tribology Letters, 4, pp. 1-35.

Affiliated with

Also associated with

Rating

Method of soldering electronic component having solder bumps... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of soldering electronic component having solder bumps..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of soldering electronic component having solder bumps... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4116455