Copper alloy and method of manufacturing the same

Details Copper alloy and method of manufacturing the same Copper alloy and method of manufacturing the same

2007-07-12

2009-02-03

Ip, Sikyin (Department: 1793)

Metal treatment

Process of modifying or maintaining internal physical...

Heating or cooling of solid metal

C148S681000, C148S682000, C148S683000, C148S684000, C148S685000

Reexamination Certificate

active

07485200

ABSTRACT:
This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

REFERENCES:
patent: 3366477 (1968-01-01), Eichelman, Jr. et al.
patent: 3830644 (1974-08-01), Watanabe et al.
patent: 5582281 (1996-12-01), Nakashima et al.
patent: 6093499 (2000-07-01), Tomioka
patent: 2002/0015657 (2002-02-01), Dong
patent: 2002/0155021 (2002-10-01), Nagai
patent: 2003/0095887 (2003-05-01), Dong
patent: 2004/0140022 (2004-07-01), Inohana et al.
patent: 2004/0159375 (2004-08-01), Yamagishi
patent: 1180917 (2002-02-01), None
patent: 61-041736 (1986-02-01), None
patent: S62-189738 (1987-08-01), None
patent: 63312936 (1988-12-01), None
patent: 2270946 (1990-11-01), None
patent: 03-243736 (1991-10-01), None
patent: 04-165055 (1992-06-01), None
patent: H07-258804 (1995-10-01), None
patent: 08-218155 (1996-08-01), None
patent: 9087814 (1997-03-01), None
patent: 10-060562 (1998-03-01), None
patent: 10081927 (1998-03-01), None
patent: 2000282156 (2000-10-01), None
patent: 2001131661 (2001-05-01), None
patent: 2002-356728 (2002-12-01), None
Takagi, Kimura; Material, 34, 8 (1995), pp. 959.
Furukawa, Horita, Nemoto, TG. Landon: Metal, 70, 11 (2000), pp. 971.
Microstructure and Mechanical Properties of Pure Copper by Accumulative Roll-Bonding(ARB)Process, Journal of the JRICu vol. 41, No. 1 (2002).
Preliminary Manuscript of 42ndLecture of Japan Research Institute for Advanced Copper-Base Materials and Technologies, pp. 55, Nov. 2002.

Affiliated with

Also associated with

Rating

Copper alloy and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloy and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloy and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4116373