Mounting apparatus for securing heat dissipation module to...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080300, C165S185000, C257S719000, C361S704000, C361S697000, C024S457000, C024S458000, C248S505000, C248S510000

Reexamination Certificate

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07554810

ABSTRACT:
A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat dissipation module, and a plurality of support devices. Each support device comprises an enlarged flange portion, a support portion extending up from an upper surface of the flange portion, and a coupling portion extending down from a lower surface of the flange portion and detachably installable to a corresponding post, thereby suspending the heat dissipation module over the socket. A plurality of sleeve bodies is for respectively receiving the posts, and configured for being sandwiched between the corresponding flange portions and the circuit board. A plurality of fasteners extending from the mounting frame is engagable with the support portions respectively.

REFERENCES:
patent: 6952348 (2005-10-01), Wu
patent: 7055790 (2006-06-01), Schroeter
patent: 7068514 (2006-06-01), Chang et al.
patent: 7349210 (2008-03-01), Sheng et al.
patent: 7365983 (2008-04-01), Huang et al.
patent: 2006/0042787 (2006-03-01), Yu et al.

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