Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-06-30
2009-10-20
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C361S719000, C029S832000, C257S719000, C439S071000, C438S106000
Reexamination Certificate
active
07606033
ABSTRACT:
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.
REFERENCES:
patent: 4748495 (1988-05-01), Kucharek
patent: 5730620 (1998-03-01), Chan et al.
patent: 5738531 (1998-04-01), Beaman et al.
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5870286 (1999-02-01), Butterbaugh et al.
patent: 5978223 (1999-11-01), Hamilton et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6261404 (2001-07-01), Baska et al.
patent: 6330745 (2001-12-01), Cromwell et al.
patent: 6385044 (2002-05-01), Colbert et al.
patent: 6415853 (2002-07-01), Tao et al.
patent: 6442026 (2002-08-01), Yamaoka
patent: 6449155 (2002-09-01), Colbert et al.
patent: 6639800 (2003-10-01), Eyman et al.
patent: 6724629 (2004-04-01), Augustin et al.
patent: 6836408 (2004-12-01), Gektin et al.
patent: 6930884 (2005-08-01), Cromwell et al.
patent: 6950310 (2005-09-01), Edwards
patent: 7323358 (2008-01-01), Cromwell
patent: 7327573 (2008-02-01), Lee et al.
patent: 2003/0192180 (2003-10-01), Colbert et al.
patent: 2004/0038583 (2004-02-01), Peterson et al.
patent: 2004/0247925 (2004-12-01), Cromwell
patent: 2005/0006055 (2005-01-01), Colbert et al.
patent: 2005/0122691 (2005-06-01), Crippen et al.
patent: 2007/0086168 (2007-04-01), Khanna et al.
patent: 2008/0081489 (2008-04-01), MacGregor et al.
Colbert John Lee
Eckberg Eric Alan
Hamilton Roger Duane
Hoffmeyer Mark Kenneth
Mikhail Amanda Elisa Ennis
Bussan Matthew J.
Gandhi Jayprakash N
International Business Machines - Corporation
Smith Courtney
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