Heatsink assembly structure

Details Heatsink assembly structure Heatsink assembly structure

2007-02-09

2009-06-30

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C165S185000, C165S080200, C174S016100, C174S016300, C257S718000, C257S719000

Reexamination Certificate

active

07554809

ABSTRACT:
A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and an abutment surface. The spring plate includes at least one fixing section and a plurality of pressing sections extending from the fixing section. When the fixing section of the spring plate is fixed to the circuit board, each of the pressing sections applies a force to press the heat conducting plate towards the heat-generating element, so as to attach the abutment surface on the heat-generating element, and conduct heat generated by the heat-generating element to the heat conducting plate. Thus, a plurality of forces pressing the heat conducting plate downward is provided with a simple structure.

REFERENCES:
patent: 5932925 (1999-08-01), McIntyre
patent: 6008989 (1999-12-01), Lee et al.
patent: 6724632 (2004-04-01), Lee et al.
patent: 7310229 (2007-12-01), Lee et al.
patent: 7321492 (2008-01-01), Wang et al.
patent: 7375963 (2008-05-01), Eckberg et al.
patent: 2005/0117307 (2005-06-01), Tanaka

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