Printed circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C174S255000

Reexamination Certificate

active

07551452

ABSTRACT:
In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

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patent: 2003068804 (2003-03-01), None
patent: 2004-134442 (2004-04-01), None
patent: 2005-150373 (2005-06-01), None

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