Method for forming a deposition film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 39, 427300, B05D 306

Patent

active

046997997

ABSTRACT:
A method for forming a deposition film by introducing a source gas into a reduced pressure deposition chamber, establishing an electric field across opposing electrode to cause discharge in the deposition chamber, and decomposing or polymerizing the source gas by a discharge energy or the discharge energy and a thermal energy to form the deposition film on a substrate disposed in the deposition chamber, characterized by that an auxiliary substrate is provided in adjacent to the substrate.

REFERENCES:
patent: 4438188 (1984-03-01), Shimatani et al.
patent: 4446168 (1984-05-01), Kato et al.
patent: 4452828 (1984-06-01), Namba et al.

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