Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-10
2009-02-17
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C362S218000, C362S294000, C362S373000, C257S722000, C165S080200, C165S080300, C165S185000, C361S703000, C361S704000, C361S690000
Reexamination Certificate
active
07492599
ABSTRACT:
A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.
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Lai Cheng-Tien
Yu Guang
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Thompson Gregory D
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