Heat sink for LED lamp

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C362S218000, C362S294000, C362S373000, C257S722000, C165S080200, C165S080300, C165S185000, C361S703000, C361S704000, C361S690000

Reexamination Certificate

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07492599

ABSTRACT:
A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.

REFERENCES:
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patent: 5894882 (1999-04-01), Kikuchi et al.
patent: 6045240 (2000-04-01), Hochstein
patent: 6397931 (2002-06-01), Lin et al.
patent: 6615910 (2003-09-01), Joshi et al.
patent: 6748656 (2004-06-01), Woerner et al.
patent: 6749009 (2004-06-01), Barten
patent: 6920046 (2005-07-01), Spryshak
patent: 7284882 (2007-10-01), Burkholder
patent: 2007/0057361 (2007-03-01), Lange et al.

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