Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2006-07-06
2009-12-01
Parker, Kenneth A (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S777000, C257S780000, C257S512000, C257S513000, C257S520000, C257S515000, C257S530000, C257SE23067
Reexamination Certificate
active
07626269
ABSTRACT:
The invention includes semiconductor assemblies having two or more dies. An exemplary assembly has circuitry associated with a first die front side electrically connected to circuitry associated with a second die front side. The front side of the second die is adjacent a back side of the first die, and a through wafer interconnect extends through the first die. The through wafer interconnect includes a conductive liner within a via extending through the first die. The conductive liner narrows the via, and the narrowed via is filled with insulative material. The invention also includes methods of forming semiconductor assemblies having two or more dies; and includes electronic systems containing assemblies with two or more dies.
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“Hysol Encapsulants”; http://www.loctite.com/int—henkel/loctite/binarydata/pdf/encapsulants—LT-4145—Final—0306051.pdf, published on Mar. 6, 2005.
Farnworth Warren M.
Oliver Steve
Micro)n Technology, Inc.
Nguyen Joseph
Parker Kenneth A
Wells St. John P.S.
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