Solid state heat pump

Refrigeration – Using electrical or magnetic effect

Reexamination Certificate

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Details

C136S200000

Reexamination Certificate

active

07628021

ABSTRACT:
In accordance with the invention, there are methods for transferring heat, for heating and cooling, and there is a solid state heat pump. The solid state heat pump can include a power supply that provides an electric field, a first metal layer, a dielectric layer disposed over the first metal layer, wherein the dielectric layer absorbs a first amount of heat upon application of the electric field and releases a second amount of heat upon alteration of the electric field, and wherein the second amount of heat is greater than the first amount of heat, and a second metal layer disposed over the dielectric layer. The alteration of the electric field can be achieved at least by one of reducing, removing, and/or reversing the polarity of the electric field. The solid state heat pump can also include a series resistor.

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J. W. McPherson, “Determination of the nature of molecular bonding in silica from time-dependent dielectric breakdown data,” Journal of Applied Physics, vol. 95, No. 12, Jun. 15, 2004, pp. 8101-8109.
J. W. McPherson, “Extended Mie-Grüneisen molecular model for time dependent dielectric breakdown in silica detailing the critical roles of O-Si=O3tetragonal bonding, stretched bonds, hole capture, and hydrogen release,” Journal of Applied Physics 99, 083501 (2006), pp. 83501-1 to 83501-13.

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