Image inspection device and image inspection method using...

Details Image inspection device and image inspection method using... Image inspection device and image inspection method using...

2007-04-17

2009-08-04

Sung, Christine (Department: 2884)

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

Reexamination Certificate

active

07569822

ABSTRACT:
In an inspection of a semiconductor wafer for a defect, when infrared light passing through a semiconductor wafer is imaged by a camera and an inspection is conducted using the image, a problem that halation occurs in the camera due to light leaking from the side of the inspection object, which makes it impossible to conduct an inspection at the periphery portion occurs. An inspection object is irradiated by an infrared light source, and transmitted light is imaged by an infrared camera to be conducted. With the use of mask means that secures a clearance from the end portion on the outer side, it is possible to inspect on the peripheral portion. Also, as means for supporting the object, plural sets of those configured to be capable of evacuating are used, and by allowing the plural sets to evacuate alternately, it is possible to inspect across the entire surface.

REFERENCES:
patent: 2002/0088952 (2002-07-01), Rao et al.
patent: 2003/0218145 (2003-11-01), Tanabe
patent: 08-220008 (1996-08-01), None
patent: 2000-065759 (2000-03-01), None
E. Rueland et al., “Optical μ-Crack Detection In Combination With Stability Testing for In-Line-Inspection of Wafers and Cells”, 20th European Photovoltaic Solar Engery Conference, Jun. 6-10, 2005, Barcelona, Spain, pp. 3242-3245.

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