Method of making and installing conductive floor tile for contro

Details Method of making and installing conductive floor tile for contro Method of making and installing conductive floor tile for contro

1985-07-12

1987-10-13

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

52390, 52746, 156276, 156297, 361215, 361216, 428922, E04F 1506, E04F 1510, H05F 302

Patent

active

046996770

ABSTRACT:
An article of manufacture which is a conductive floor tile for control of generation of static electricity and method of installation. The tile includes a thin, hard layer of plastic material having bonded to it a lamination which is an electrically conductive mesh screen which is bonded to the top surface lamination by an electrically conductive adhesive. The product is a tile, the tiles being adapted for being bonded to a surface adjacent to each other with electrically conductive strips positioned beneath the joints between adjacent tiles to provide electrical continuity. The method includes the fabrication of the tiles and the steps in the installation of the tiles as described by being bonded to a surface or subsurface. The product may be fabricated with a thin layer of adhesive on the underside of the wire mesh screen covered by a layer of backing material, such as paper, which can be removed to allow the tile to be bonded to a surface as an individual tile or in accordance with the method as referred to.

REFERENCES:
patent: 1939961 (1933-12-01), Emig
patent: 2173622 (1939-09-01), Crooks
patent: 2325414 (1943-07-01), McChesney
patent: 2457299 (1948-12-01), Biemesderfer
patent: 3121825 (1964-02-01), Abegg
patent: 3347978 (1967-10-01), Simon
patent: 4084031 (1978-04-01), Barsy
patent: 4308568 (1981-12-01), Whewell

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