Semiconductor device

Measuring and testing – Fluid pressure gauge – Electrical

Reexamination Certificate

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C361S283400, C257S704000

Reexamination Certificate

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07607355

ABSTRACT:
A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.

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patent: S62-20343 (1987-02-01), None
patent: 2004-537182 (2004-12-01), None
Office Action issued May 26, 2009, on the counterpart Korean Patent Application No. Oct. 2008-0013121 and partial English translation thereof.

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