Composition of epoxy and anhydride components, antioxidant...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C523S459000, C525S508000, C525S533000

Reexamination Certificate

active

07622516

ABSTRACT:
A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

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