Wiring board with semiconductor component

Details Wiring board with semiconductor component Wiring board with semiconductor component

2005-11-03

2009-02-10

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S767000

Reexamination Certificate

active

07488896

ABSTRACT:
An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a flip-chip connection. The semiconductor component is flip-chip bonded at a pad array at a component side thereof to a pad array at a board side by way of an individual solder joint portion. In a solder resist layer at a semiconductor component side and a solder resist layer at a board side, D/D0is prepared to be in a range of 0.70 to 0.99, where D is a bottom inner diameter of an opening at the board side and D0is a bottom inner diameter of an opening at the component side.

REFERENCES:
patent: 6402013 (2002-06-01), Abe et al.
patent: 7119003 (2006-10-01), Bernier et al.
patent: 2001/0013423 (2001-08-01), Dalal et al.
patent: 2002031889 (2002-01-01), None
Takao et al., “Development of Highly Reliable SnAg Lead-Free Solder Alloy,” Toyota Central R&D Labs. Inc., R&D Review, vol. 35, No. 2 (Jun. 2000), including abstract.

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