Multilayered printed wiring board and manufacturing method...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S624000, C428S626000, C428S646000, C174S259000, C361S751000

Reexamination Certificate

active

07485361

ABSTRACT:
An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer5of the multi-layered printed wiring board. The multi-layered printed wiring board is manufactured by taking the steps such as (a) a steps for producing a primer resin sheet with a carrier film including a 2 micron m to 12 micron m thick primer resin layer; (b) a steps for placing the primer resin sheet on the inner-layer circuit board in which the primer resin layer of the primer resin sheet with a carrier film is placed on the inner layer circuit board and then the carrier film is removed; (c) a steps for pressing in which a pre-preg and a metal foil for forming a conductive layer are superposed on the primer resin sheet, and pressed to form the multi-layered metal clad laminate; and (d) a steps for forming an outer layer circuit wherein the outer layer circuit is formed by etching the outer layer metal foil of the multi-layered metal clad laminate to make the multi-layered printed wiring board.

REFERENCES:
patent: 6187416 (2001-02-01), Satoh et al.
patent: 6652962 (2003-11-01), Sato et al.
patent: 6716530 (2004-04-01), Sato et al.
patent: 6831129 (2004-12-01), Sato et al.
patent: 6905757 (2005-06-01), Matsushima et al.
patent: 58-118241 (1983-07-01), None
patent: 2-303187 (1990-12-01), None
patent: 2001-284821 (2001-10-01), None
patent: 2002-314243 (2002-10-01), None
patent: 2003-127313 (2003-05-01), None
patent: 2003-249739 (2003-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayered printed wiring board and manufacturing method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered printed wiring board and manufacturing method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered printed wiring board and manufacturing method... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4095833

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.