Mounting apparatus for ball grid array device

Electrical connectors – Coupling part having handle or means to move contact...

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Details

439259, H01R 1122

Patent

active

055562930

ABSTRACT:
Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grad array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

REFERENCES:
patent: 4420205 (1983-12-01), Kirkman
patent: 4739257 (1988-04-01), Jenson et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5281160 (1994-01-01), Walkup et al.

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