Manufacturing method of flexible printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S830000, C029S846000, C029S879000, C228S179100, C438S066000

Reexamination Certificate

active

07543376

ABSTRACT:
Provided is an FPC, which comprises an insulating layer2, wiring layers3and4laminated above and under the insulating layer2, and a layer connection for connecting the wiring layers3and4electrically. The layer connection is constituted to comprise: a conductor press-fit hole5of a cone shape extending through the insulating layer2and the upper and lower wiring layers3and4and expanded to the side of one wiring layer3; and a conductor6filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer3deformed into the cone shape of the conductor press-fit hole5, and is protruded from the other wiring lower layer4to have its surface partially coated and jointed. As a result, the contact area between the wiring layers3and4and the conductor6filled in the conductor press-fit hole5can be enlarged to retain the contact strength between the wiring layers3and4and the conductor6sufficiently thereby to provide a high connection reliability for the layer connection.

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patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4712721 (1987-12-01), Noel et al.
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patent: 6768064 (2004-07-01), Higuchi et al.
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patent: 6914200 (2005-07-01), Higuchi et al.
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patent: 2002/0157248 (2002-10-01), Karlsson et al.
patent: 2003/0003779 (2003-01-01), Rathburn
patent: 2004/0195002 (2004-10-01), Higuchi et al.
patent: 2005/0205291 (2005-09-01), Yamashita et al.
patent: 5-175636 (1993-07-01), None
patent: 7-176847 (1995-07-01), None
English Language Abstract of JP 5-175636, published Jul. 13, 1993.
English Language Abstract of JP 7-176847, published Jul. 14, 1995.

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