Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-08-08
2009-12-15
Ta, Tho D (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000, C439S591000, C439S592000
Reexamination Certificate
active
07632106
ABSTRACT:
The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower wall provided with a second slot, a contact comprising a first contact portion on which a lead of the IC is loaded, a second contact portion coming into contact with a circuit lead of the circuit board, a contact main body communicating the first contact portion with the second contact portion, and a compressing portion protruding from the rear of the contact main body, the resilient member receiving area receiving the resilient member of integral structure, set in the resilient member receiving area, in which a plurality of contacts are implanted, wherein the compressing portion compresses the resilient member in order that a contact pressure can be obtained for the contact to the IC lead and the circuit lead by means of a restoring force of the resilient member.
REFERENCES:
patent: 4445735 (1984-05-01), Bonnefoy
patent: 5069629 (1991-12-01), Johnson
patent: 5207584 (1993-05-01), Johnson
patent: 5336094 (1994-08-01), Johnson
patent: 5388996 (1995-02-01), Johnson
patent: 5634801 (1997-06-01), Johnson
patent: 5749738 (1998-05-01), Johnson
patent: 5841640 (1998-11-01), Shibata
patent: 5899755 (1999-05-01), Kline
patent: 5913687 (1999-06-01), Rathburn
patent: 5938451 (1999-08-01), Rathburn
patent: 5947749 (1999-09-01), Rathburn
patent: 5967848 (1999-10-01), Johnson et al.
patent: 6135783 (2000-10-01), Rathburn
patent: 6178629 (2001-01-01), Rathburn
patent: 6191434 (2001-02-01), Sakamoto
patent: 6231353 (2001-05-01), Rathburn
patent: 6244874 (2001-06-01), Tan
patent: 6247938 (2001-06-01), Rathburn
patent: 6409521 (2002-06-01), Rathburn
patent: 6572396 (2003-06-01), Rathburn
patent: 6702609 (2004-03-01), Suzuki et al.
patent: 6854981 (2005-02-01), Nelson
patent: 7121842 (2006-10-01), Kimura
patent: 7297003 (2007-11-01), Rathburn
patent: 7303404 (2007-12-01), Osato et al.
patent: 7326064 (2008-02-01), Rathburn
patent: 7338293 (2008-03-01), Gilk
patent: 7422439 (2008-09-01), Rathburn
patent: 7445465 (2008-11-01), Lopez et al.
patent: 2006/0183356 (2006-08-01), Kimura
patent: 2007/0007948 (2007-01-01), Kimura et al.
patent: 2007/0032128 (2007-02-01), Lopez et al.
patent: 2007/0069793 (2007-03-01), Cranford
patent: 2007/0236236 (2007-10-01), Dennis et al.
patent: 2008/0182436 (2008-07-01), Rathburn
patent: 2009/0021274 (2009-01-01), Kimura
patent: 2009/0053912 (2009-02-01), Lopez et al.
patent: 0718917 (1996-06-01), None
patent: 0752741 (1997-01-01), None
patent: 0809328 (1997-11-01), None
patent: 1482595 (2004-12-01), None
patent: 5174880 (1993-07-01), None
patent: 7073943 (1995-03-01), None
patent: 2675710 (1997-11-01), None
patent: 2807171 (1998-10-01), None
patent: 11-031566 (1999-02-01), None
patent: 11-045768 (1999-02-01), None
patent: 11-102764 (1999-04-01), None
patent: 11-162605 (1999-06-01), None
patent: 2000046871 (2000-02-01), None
patent: 2001-035619 (2001-02-01), None
patent: 2001-135441 (2001-05-01), None
patent: 2001-235510 (2001-08-01), None
patent: 2001-237037 (2001-08-01), None
patent: 2001-257049 (2001-09-01), None
patent: 2001-305184 (2001-10-01), None
patent: 2001-319749 (2001-11-01), None
patent: 2001-326047 (2001-11-01), None
patent: 2001524256 (2001-11-01), None
patent: 2002-181881 (2002-06-01), None
patent: 2002-246128 (2002-08-01), None
patent: 2002-280137 (2002-09-01), None
patent: 2002-328149 (2002-11-01), None
patent: 2003-045593 (2003-02-01), None
patent: 2003086313 (2003-03-01), None
patent: 2003-123874 (2003-04-01), None
patent: 2003-217777 (2003-07-01), None
patent: 2003-232805 (2003-08-01), None
patent: 2003536203 (2003-12-01), None
patent: 2004061390 (2004-02-01), None
patent: 2004-247194 (2004-09-01), None
patent: 2006-216399 (2006-08-01), None
patent: 2006-351474 (2006-12-01), None
patent: 2007017444 (2007-01-01), None
patent: 3924329 (2007-06-01), None
patent: 2007535094 (2007-11-01), None
patent: 4195588 (2008-12-01), None
patent: 2005119856 (2005-12-01), None
patent: 2006006248 (2006-01-01), None
patent: 2006085388 (2006-08-01), None
Banner & Witcoff , Ltd.
Ta Tho D
Yamaichi Electronics Co. Ltd.
LandOfFree
IC socket to be mounted on a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket to be mounted on a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket to be mounted on a circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4091748