Cleaning method and a cleaning device for cleaning an edge...

Cleaning and liquid contact with solids – Processes – Combined

Reexamination Certificate

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C134S033000, C134S902000, C427S008000, C427S240000

Reexamination Certificate

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07632358

ABSTRACT:
A method for cleaning a wafer includes measuring a cross-sectional shape of an edge portion of wafer cut along a radial direction, assigning the measured shape to one of a plurality of groups classified by the shapes, determining an amount of cleaning liquid to be supplied and rotational speed at which the wafer is rotated depending a determination criterion, rotating the wafer and spraying the cleaning liquid toward a back face of the rotating wafer, and cleaning the edge portion and the back face of the wafer by spreading the cleaning liquid to the edge portion of the wafer.

REFERENCES:
patent: 2003/0106642 (2003-06-01), Fairbairn et al.
patent: 02-198131 (1990-08-01), None

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