Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-03-12
2009-11-10
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE25013, C257S700000, C257S734000, C257S347000, C438S611000, C438S106000
Reexamination Certificate
active
07615411
ABSTRACT:
A semiconductor package includes a base plate, at least one semiconductor constructing body which is formed on one surface of the base plate and has a plurality of external connection electrodes formed on a semiconductor substrate, an insulating layer which is formed on one surface of the base plate around the semiconductor constructing body, upper interconnections which are formed on the insulating layer and each includes at least one interconnection layer, at least some of the upper interconnections are connected to the external connection electrodes of the semiconductor constructing body, lower interconnections which are formed on the other surface of the base plate and each includes at least one interconnection layer, and at least some of the lower interconnections which are electrically connected to the upper interconnections.
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European Search Report dated Dec. 30, 2008, and English translation thereof issued in counterpart European Application No. 04 735 511.0.
Casio Computer Co. Ltd.
CMK Corporation
Diallo Mamadou
Frishauf Holtz Goodman & Chick P.C.
Richards N Drew
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