Method and apparatus for removing thin metal films

Details Method and apparatus for removing thin metal films Method and apparatus for removing thin metal films

2005-04-11

2009-06-09

Wilkins, III, Harry D. (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Defined electrolyte movement or pressure

C205S133000, C205S640000, C205S668000, C205S686000, C204S194000, C204S199000

Reexamination Certificate

active

07544283

ABSTRACT:
A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.

REFERENCES:
patent: 6153535 (2000-11-01), Takimoto
patent: 6723224 (2004-04-01), Yahalom et al.
patent: 2002/0011421 (2002-01-01), Haba et al.
patent: S51-050247 (1976-05-01), None
patent: S59-193859 (1984-12-01), None
patent: S62-290900 (1987-12-01), None
patent: H07-207500 (1995-08-01), None

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