Semiconductor package having improved thermal performance

Details Semiconductor package having improved thermal performance Semiconductor package having improved thermal performance

2005-12-22

2009-11-03

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23037, C257SE23044, C257SE23069, C257SE23071, C257SE23178, C257S666000, C257S686000, C257S685000, C257S724000, C257S723000, C257S691000, C257S698000, C257S696000, C257S773000, C257S341000

Reexamination Certificate

active

07612439

ABSTRACT:
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

REFERENCES:
patent: 6593622 (2003-07-01), Kinzer et al.
patent: 7215012 (2007-05-01), Harnden et al.

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