Plastic semiconductor package having improved control of...

Details Plastic semiconductor package having improved control of... Plastic semiconductor package having improved control of...

2006-11-07

2009-12-08

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S784000, C257S777000, C257SE23116

Reexamination Certificate

active

07629696

ABSTRACT:
A device with a semiconductor chip assembled on a planar substrate and encapsulation compound surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area. The encapsulation compound has a plurality of side areas reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

REFERENCES:
patent: 5708300 (1998-01-01), Woosley et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6177724 (2001-01-01), Sawai
patent: 6396159 (2002-05-01), Shoji
patent: 6459159 (2002-10-01), Miyagawa et al.
patent: 6563199 (2003-05-01), Yasunaga et al.
patent: 6717279 (2004-04-01), Koike
patent: 6853064 (2005-02-01), Bolken et al.
patent: 6867487 (2005-03-01), Huang et al.
patent: 7109576 (2006-09-01), Bolken et al.
patent: 7147447 (2006-12-01), Takahashi
patent: 2002/0015748 (2002-02-01), Miyajima et al.
patent: 2002/0025352 (2002-02-01), Miyajima
patent: 2002/0195697 (2002-12-01), Mess et al.
patent: 2004/0082114 (2004-04-01), Horng
patent: 0971401 (2000-01-01), None

Affiliated with

Also associated with

Rating

Plastic semiconductor package having improved control of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic semiconductor package having improved control of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic semiconductor package having improved control of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4088843