Process for filling via hole in a substrate

Details Process for filling via hole in a substrate Process for filling via hole in a substrate

2004-03-18

2009-06-09

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C174S262000, C205S170000, C205S191000, C216S018000, C216S065000, C427S097900

Reexamination Certificate

active

07543375

ABSTRACT:
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.

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