Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate
2004-02-13
2009-11-03
Tran, Binh X (Department: 1792)
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
C427S544000, C427S550000, C427S554000, C427S596000
Reexamination Certificate
active
07611756
ABSTRACT:
The invention relates to a method for coating particles of a plastic, metal and/or ceramic powder material for producing an adhesive-containing coating material, in particular for producing appropriate particles by compressing a 3D binder. Said coating is applied to fluidized particles in a gaseous phase by means of a coating solution, at least the particles and/or coated particles being exposed to ionized particles. A method for producing bodies or sintered bodies from organic liquid binders by compressing the 3D binder and the use thereof are also disclosed.
REFERENCES:
patent: 5489449 (1996-02-01), Umeya et al.
patent: 5585426 (1996-12-01), Williams et al.
patent: 6224798 (2001-05-01), Gay
patent: 2001/0033899 (2001-10-01), Noguchi et al.
patent: 2004/0018109 (2004-01-01), Blatter et al.
patent: 38 16 337 (1990-09-01), None
patent: 41 09 979 (1991-10-01), None
patent: 0 897 745 (1999-02-01), None
patent: 1 163 999 (2001-12-01), None
patent: 03267301 (1991-11-01), None
patent: 10226801 (1998-08-01), None
patent: WO 03/106146 (2003-12-01), None
Pfeifer Rolf
Shen Jialin
Daimler AG
Patent Central LLC
Pendorf Stephen A.
Tran Binh X
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