Methods and apparatuses for transferring heat from stacked...

Details Methods and apparatuses for transferring heat from stacked... Methods and apparatuses for transferring heat from stacked...

Filed on

2005-08-25

Date issued

2009-10-13

Examiner

Dinh, Tuan T (Department: 2841)

Patent Class

Electricity: electrical systems and devices

SubClass

Housing or mounting assemblies with diverse electrical...

SubSubClass

For electronic systems and devices

Other Related Categories

C361S700000, C361S803000

Type

Reexamination Certificate

Status

active

Patent number

07602618

Description

ABSTRACT:
Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

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