Semiconductor device and method of manufacturing...

Details Semiconductor device and method of manufacturing... Semiconductor device and method of manufacturing...

2008-04-04

2009-10-27

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S784000, C257SE23054, C438S111000, C438S112000

Reexamination Certificate

active

07608930

ABSTRACT:
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface.

REFERENCES:
patent: 2007/0126092 (2007-06-01), San Antonio et al.
patent: 2007/0176267 (2007-08-01), Abbott
patent: 2006-140265 (2006-06-01), None

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