Method for fabricating thin film pattern and method for...

Electrical connectors – With circuit conductors and safety grounding provision – Grounding to conductive sheath of cable

Reexamination Certificate

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C438S149000, C438S781000, C438S790000, C257SE51027

Reexamination Certificate

active

07544069

ABSTRACT:
A method for fabricating a thin film pattern and a method for fabricating a flat panel display device using the same to form an organic material pattern by not using a photo process are disclosed. The method for fabricating the thin film pattern includes forming a first conductive thin film pattern on a substrate; forming a master mold provided with a second thin film pattern; coating an organic material on the master mold provided with the second thin film pattern; joining the substrate and the master mold to contact the first thin film pattern and a surface of the substrate with the organic material; hardening the organic material; separating the substrate and the master mold from each other to provide an organic thin film pattern having step coverage formed by the second thin film pattern on a substrate provided with the first thin film pattern.

REFERENCES:
patent: 6037635 (2000-03-01), Yamazaki
patent: 6955767 (2005-10-01), Chen
patent: 7226804 (2007-06-01), Shin et al.
patent: 7465612 (2008-12-01), Chae et al.
patent: 2004/0262599 (2004-12-01), Bernds et al.
patent: 2005/0170621 (2005-08-01), Kim et al.
patent: 2006/0108905 (2006-05-01), Cho et al.

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