Extracting an implied value of a component associated with a...

Details Extracting an implied value of a component associated with a... Extracting an implied value of a component associated with a...

2003-02-05

2009-11-24

Bayat, Bradley (Department: 3624)

Data processing: financial, business practice, management, or co

Automated electrical financial or business practice or...

Operations research or analysis

Reexamination Certificate

active

07624035

ABSTRACT:
A method for extracting an implied value of a component associated with a plurality of product packages is disclosed. One embodiment of the method includes receiving data associated with a plurality of product packages. It is noted that the data comprises product package price data associated with the plurality of product packages. The data is processed utilizing a mathematical optimization to produce first output data. The first output data is processed with a statistical regression to produce second output data. The second output data includes an estimated value and its standard error of a component associated with the plurality of product packages.

REFERENCES:
patent: 5539652 (1996-07-01), Tegethoff
patent: 7013285 (2006-03-01), Rebane
patent: 7567917 (2009-07-01), Miller et al.
Y. Li et al “Design Factors and Their Effect on PCB Assembly Yield-Statistical and Neural Network Predictive Models”., Jun. 1994, IEEE transactions on components, packaging, and manufacturing technology-Part A, vol. 17, No. 2, pp. 183-191.
Christodoulos (Quadratic Optimization), Department of Chemical Engineering, pp. 1-53.

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