Microwave antenna for flip-chip semiconductor modules

Details Microwave antenna for flip-chip semiconductor modules Microwave antenna for flip-chip semiconductor modules

2005-03-16

2009-11-03

Chen, Shih-Chao (Department: 2821)

Communications: radio wave antennas

Antennas

Slot type

C343S789000

Reexamination Certificate

active

07612728

ABSTRACT:
The invention relates to a microwave antenna for flip-chip semiconductor modules, comprising two semiconductor substrates which are metallized on the surface thereof. Patch antennas, i.e. metallized flat areas which are insulated from the rest of the circuit on an outer surface of a module with a supply line to the circuit, are already known per se. They result in vertical radiation at a relatively large angle. According to the invention, a closed group of bumps are arranged in such a way that the distance of the bumps (2) to each other is less than the half wavelength (λ/2) of the microsignal which is to be radiated or received and an open radiation slot arises in at least one pair of side walls (3,4) of the semiconductor substrates (a,b) and a bump, which is connected to the circuit of the semiconductor module, is arranged between the bumps (2) and the radiation slot, enabling the microwave antenna to be excited.

REFERENCES:
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 2002/0145566 (2002-10-01), Ballantine et al.
patent: 691 18 060 (1996-08-01), None
patent: 1 258 948 (2002-11-01), None
patent: 09252217 (1997-09-01), None
Lubecke V.M. et al.:“Micromachining for Terahertz Applications”, IEEE Transactions on Microwave Theory and Techniques, IEEE Inc., New York, US, vol. 46, No. 11, Part 2, Nov. 1998, pp. 1821-1831.
Munson, R.E.:“Conformed Microstrip Antennas and Microstrip Phase Arrays”, IEEE Transactions on Antennas and Propagation, vol. 22, 1975, pp. 74-78.
Zurcher, J.F. and Gardiol, F.E.:“Broadband Patch Antennae”, Boston, Artech House Inc., 1995.
International Search Report of Application No. PCT/EP2005/003303 dated Aug. 28, 2005.

Affiliated with

Also associated with

Rating

Microwave antenna for flip-chip semiconductor modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microwave antenna for flip-chip semiconductor modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave antenna for flip-chip semiconductor modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4082623