Method of manufacturing an electronic component package

Details Method of manufacturing an electronic component package Method of manufacturing an electronic component package

2007-02-21

2009-10-27

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C438S106000

Reexamination Certificate

active

07607222

ABSTRACT:
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board and forming a circuit pattern, which includes a bonding pad and a solder ball pad, on the surface of the insulation layer; mounting an electronic component on the surface of the insulation layer and electrically connecting the electronic component and the bonding pad; and removing the first carrier board and the protrusion part, allows the mounting of the electronic component with just a single circuit pattern layer.

REFERENCES:
patent: 6897096 (2005-05-01), Cobbley et al.
patent: 6964201 (2005-11-01), Xu et al.
patent: 7018866 (2006-03-01), Sugaya et al.
patent: 7169652 (2007-01-01), Kimura
patent: 7351608 (2008-04-01), Mountain
patent: 2005/0116299 (2005-06-01), Koning et al.
Chinese Patent Office Action, mailed Aug. 8, 2008 and issued in corresponding Chinese Patent Application No. 200710086740.1.

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