Method for making a multilayered circuitized substrate

Details Method for making a multilayered circuitized substrate Method for making a multilayered circuitized substrate

2007-05-02

2009-12-08

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S846000, C174S261000

Reexamination Certificate

active

07627947

ABSTRACT:
A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.

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