Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-07-10
2009-12-15
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S710000, C257SE23180, C257SE23181, C257SE23188, C257SE23192, C257SE23193
Reexamination Certificate
active
07633150
ABSTRACT:
A disclosed semiconductor device comprises a substrate, an element on the substrate and a sealing structure for sealing the element. The sealing structure has a structure such that a partition wall made of a metallic material formed on the substrate by a plating method so as to surround the element and a cap portion disposed on the partition wall are bonded via a bonding layer made of an inorganic material.
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Clark Jasmine J
Ladas & Parry LLP
Shinko Electric Industries Co. Ltd.
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