Method and system to dynamically compensate for probe tip...

Details Method and system to dynamically compensate for probe tip... Method and system to dynamically compensate for probe tip...

2008-03-19

2009-12-08

Karlsen, Ernest F (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C029S846000, C324S760020, C702S085000

Reexamination Certificate

active

07629805

ABSTRACT:
Method for dynamically compensating probe tip misalignment with a semiconductor wafer. The wafer is located on a handler and the wafer is adjusted to a first temperature. Probe tips of an inspection system are moved to a first position centered above pads of a test module on the wafer. The first position is recorded in a memory of the inspection system at the first temperature. The wafer and the probe tips are adjusted to a second temperature while the wafer remains in the inspection system. A second position of the probe tips is recorded in the memory while the probe tips and the wafer are equilibrated at the second temperature. A difference between the first and second position is calculated. Relative positions of the probe tips or the wafer is compensated based on the calculated difference, such that the probe tips are re-centered above the pads at the second temperature.

REFERENCES:
patent: 3963985 (1976-06-01), Geldermans
patent: 4063172 (1977-12-01), Faure et al.
patent: 5689447 (1997-11-01), Ward
patent: 7002363 (2006-02-01), Mathieu
patent: 7312618 (2007-12-01), Eldridge et al.

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