Current sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE43003, C257SE27005, C174S536000, C324S11700H

Reexamination Certificate

active

07598601

ABSTRACT:
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor position. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

REFERENCES:
patent: 4893073 (1990-01-01), McDonald et al.
patent: 5041780 (1991-08-01), Rippel
patent: 5124642 (1992-06-01), Marx
patent: 5247202 (1993-09-01), Popovic et al.
patent: 5442228 (1995-08-01), Pham et al.
patent: 5561366 (1996-10-01), Takahashi et al.
patent: 5615075 (1997-03-01), Kim
patent: 6005383 (1999-12-01), Savary et al.
patent: 6150714 (2000-11-01), Andreycak et al.
patent: 6252389 (2001-06-01), Baba et al.
patent: 6316931 (2001-11-01), Nakagawa et al.
patent: 6323634 (2001-11-01), Nakagawa et al.
patent: 6356068 (2002-03-01), Steiner et al.
patent: 6411078 (2002-06-01), Nakagawa et al.
patent: 6424018 (2002-07-01), Ohtsuka
patent: 6445171 (2002-09-01), Sandquist et al.
patent: 6462531 (2002-10-01), Ohtsuka
patent: 6545456 (2003-04-01), Radosevich et al.
patent: 6566856 (2003-05-01), Sandquist et al.
patent: 6642705 (2003-11-01), Kawase
patent: 6667682 (2003-12-01), Wan et al.
patent: 6683448 (2004-01-01), Ohtsuka
patent: 6727683 (2004-04-01), Goto et al.
patent: 6759841 (2004-07-01), Goto et al.
patent: 6781359 (2004-08-01), Stauth et al.
patent: 6791313 (2004-09-01), Ohtsuka
patent: 6812687 (2004-11-01), Ohtsuka
patent: 6841989 (2005-01-01), Goto et al.
patent: 6867573 (2005-03-01), Carper
patent: 6921955 (2005-07-01), Goto et al.
patent: 6989665 (2006-01-01), Goto et al.
patent: 6995315 (2006-02-01), Sharma et al.
patent: 7006749 (2006-02-01), Illich et al.
patent: 7075287 (2006-07-01), Mangtani et al.
patent: 7166807 (2007-01-01), Gagnon et al.
patent: 7248045 (2007-07-01), Shoji
patent: 7259545 (2007-08-01), Stauth et al.
patent: 7348724 (2008-04-01), Taylor et al.
patent: 2001/0028115 (2001-10-01), Yanagawa et al.
patent: 2002/0179987 (2002-12-01), Meyer et al.
patent: 2005/0045359 (2005-03-01), Doogue et al.
patent: 2005/0230843 (2005-10-01), Williams
patent: 2006/0002147 (2006-01-01), Hong et al.
patent: 2006/0071655 (2006-04-01), Shoji
patent: 2006/0091993 (2006-05-01), Shoji
patent: 2006/0114098 (2006-06-01), Shoji
patent: 2006/0145690 (2006-07-01), Shoji
patent: 2006/0170529 (2006-08-01), Shoji
patent: 2006/0181263 (2006-08-01), Doogue et al.
patent: 2006/0219436 (2006-10-01), Taylor et al.
patent: 2006/0291106 (2006-12-01), Shoji
patent: 2007/0044370 (2007-03-01), Shoji
patent: 2007/0076332 (2007-04-01), Shoji
patent: 2007/0090825 (2007-04-01), Shoji
patent: 2007/0096716 (2007-05-01), Shoji
patent: 2007/0188946 (2007-08-01), Shoji
patent: 2007/0279053 (2007-12-01), Taylor et al.
patent: 2009/0058412 (2009-03-01), Taylor et al.
patent: 4 141 386 (1993-06-01), None
patent: 4 141 386 (1993-06-01), None
patent: 0 867 725 (1998-09-01), None
patent: 1 107 327 (2001-06-01), None
patent: 1 107 328 (2001-06-01), None
patent: 1 111 693 (2001-06-01), None
patent: 1 180 804 (2002-02-01), None
patent: 61-71649 (1986-04-01), None
patent: 04-364472 (1992-12-01), None
patent: 2000174357 (2000-06-01), None
patent: 2001165963 (2001-06-01), None
patent: 2001174486 (2001-06-01), None
patent: 2001221815 (2001-08-01), None
patent: 2001230467 (2001-08-01), None
patent: 2001339109 (2001-12-01), None
patent: 2002026419 (2002-01-01), None
patent: 2002202326 (2002-07-01), None
patent: 2002202327 (2002-07-01), None
patent: WO 99/14605 (1999-03-01), None
patent: WO 2005/026749 (2005-03-01), None
patent: WO 2006/130393 (2006-12-01), None
PCT Search Report and Written Opinion of the ISA for PCT/US2004/009908 dated Aug. 16, 2004.
PCT Search Report and Written Opinion of the ISA for PCT/US2006/019953 dated Sep. 25, 2006.
Mosbarger et al.; “The Effects of Materials and Post-Mold Profiles on Plastic Encapsulated Integrated Circuits;” IEEE/IRPS; Apr. 1994; pp. 93-100.
Steiner, et al.; “Fully Packaged CMOS Current Monitor Using Lead-on-Chip Technology;” Physical Electronics Laboratory, ETH Zurich, CH8093 Zurich, Switzerland; No. 0-7803-4412-X/98; IEEE 1998; pp. 603-608.
File downloaded from PAIR for U.S. Appl. No. 11/383,021, filed May 23, 2006, Image File Wrapper through Jan. 15, 2009, Part 1 of 2, 315 pages.
File downloaded from PAIR for U.S. Appl. No. 11/383,021, filed May 23, 2006, Image File Wrapper through Jan. 15, 2009, Part 2 of 2, 1-293 pages.
File downloaded from PAIR for U.S. Appl. No. 11/776,242, filed Jul. 11, 2007, Image File Wrapper through Feb. 9, 2009, 540 pages.
Chinese Office Action for Chinese National Stage Application No. CN 2004 80024296.5 dated Apr. 29, 2009 (PCT/US2004/009908).
Chinese Office Action for Chinese National Stage Application No. CN 2004 80024296.5 dated Sep. 26, 2008 (PCT/US2004/009908).
Chinese Office Action for Chinese National Stage Application No. CN 2004 80024296.5 dated May 6, 2008 (PCT/US2004/009908).
Chinese Office Action for Chinese National Stage Application No. CN 2004 80024296.5 dated Nov. 23, 2007 (PCT/US2004/009908).
European Office Action for European National Stage Application No. EP 04816162.4 dated Jan. 2, 2008 (PCT/US2004/009908).
European Office Action for European National Stage Application No. EP 04816162.4 dated Jun. 27, 2007 (PCT/US2004/009908).
Japanese Final Office Action for Japanese National Stage Application No. JP 2006-524610 dated Apr. 23, 2009 (PCT/US2004/009908).
Japanese Office Action for Japanese National Stage Application No. JP 2006-524610 dated Sep. 10, 2008 (PCT/US2004/009908).
Japanese Office Action for Japanese National Stage Application No. JP 2006-524610 dated Jul. 10, 2008 (PCT/US2004/009908).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Current sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Current sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Current sensor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4076679

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.